Revealing Nanoscale deformation mechanisms caused by shear-based material removal on individual grains of a Ni-based superalloy

Shear-based material removal processes significantly influence the quality of workpiece surface and implicitly component functional performance. An in-situ SEM nano-cutting enabled study crystal flow lattice rotation occurring below cutting edge in a polycrystalline Nickel superalloy. When within single grains deformed nanolayer appears that consists rotated exclusively plane which is delimited from bulk grain by high angle boundary (HAB); depth increases with pile-up (nano-chip) caused shearing. Upon multiple grains, nano-recrystallisation at HAB occurs, accompanied bending (GB) direction, phenomenon also influences deformation behaviour cut after passing GB. Clarifying these aspects nanoscale crucial for understanding formation damage operations.